News
Recognizing the challenges facing electronics assemblers as they convert to lead-free processes, Cookson Electronics Assembly Materials (Jersey City, NJ) is launching the CE Analytics Lead-Free Process Capability Validation Program.
The program consists of two elements: a test kit containing Cookson's laminates, pad finishes, stencils, lead-free solder paste and cored wire combined with boards, lead-free components and set up software from Practical Components. The second element is a lead-free process capability report based on CE Analytics' analytical evaluation and process capability validation services conducted on finished assemblies tested to IPC and J-STD requirements.
"We spoke with customers who were concerned about the time and cost associated with successfully transitioning to lead-free," said Tom Hunsinger, Cookson Electronics' product manager. "Their main concerns were reliably validating their lead-free process, and having a single source that offered all of the required materials and analytical services. They wanted to make one call to get the complete package."
The kit contains the consumable materials needed to set up and run a lead-free surface-mount process. The test boards are then built and sent to CE Analytics where lead-free process capability assessment services are conducted. The output is a detailed laboratory analysis report with recommendations for process optimization.
Cookson Electronics Assembly Materials, a Cookson Electronics company, manufactures materials used in electronic assembly processes. CE Analytics is Cookson's resource for diagnostics solutions, analytical services and applications expertise.
www.cooksonelectronics.com/no-lead
Copyright 2004, UP Media Group. All rights reserved.
Sanmina-SCI Corp. (San Jose, CA), a global electronics manufacturing services (EMS) company, has entered into an agreement to acquire Pentex-Schweizer Circuits Ltd., a provider of printed circuit board fabrication. The acquisition includes operations in Wuxi, China and Singapore.
Under the agreement, Pentex-Schweizer shareholders will be entitled to elect to receive $0.2006 per share. The total transaction value, including consideration for shares and options, is approximately $78.8 million.
The transaction is subject to several conditions, including approval by Pentex-Schweizer shareholders and court approval of the transaction under Singapore law, and is expected to close in Sanmina-SCI's fiscal 2004 fourth quarter or in its first quarter of fiscal 2005.
In addition, Sanmina-SCI and Pentex-Schweizer Circuits Ltd. have entered into a transition manufacturing agreement under which Pentex-Schweizer will provide PCB fabrication services to Sanmina-SCI during the period prior to closing and under which the companies will undertake transition manufacturing activities.
The operations in Wuxi, China and Singapore comprise 470,000 sq. ft. of manufacturing space, with additional expansion capabilities in China of 450,000 sq. ft. These two operations complement Sanmina-SCI's PCB facility in Malaysia.
Jure Sola, chairman and chief executive officer of Sanmina-SCI, said, "For quite some time, we have been carefully evaluating a number of expansion opportunities in China.
Pentex-Schweizer Circuits Ltd., an efficient, well-run operation with a group of talented employees, will provide us with a solid foundation to support our customers' requirements in this region. We expect to capitalize on the company's ability to manufacture high quality boards by leveraging our vertical integration strategy.
Copyright 2004, UP Media Group. All rights reserved.
Early recognition of errors is becoming increasingly important when inspecting assemblies. In addition to proven 2-D evaluation for offset, completeness and smearing, Viscom (Norcross, GA) now presents 3-D paste inspection as an auxiliary option for the familiar S3054QS QuickScan Inspection System. The 3-D option can be used particularly for critical components such as ball grid arrays (BGAs) and flip chips.
The inspection system is distinguished by it short programming times and high-speed error recognition for flexible production. The simple programming allows set-up operations for different products to be accomplished within a short time.
Beginning immediately, 3-D inspection is available for checking paste printing. For this application, Viscom implemented a light section method using a dual-line laser illumination to allow image recording. With the aid of this new, modular 3-D height sensor, a height resolution of 10mm is possible.
In addition to the error characteristics of missing paste, smearing and short circuits, the height of the past print, the volume and the topography can be measured and evaluated.
The 3-D option fits in the company's existing automatic optical instpection environment and is compatible with all known tools and auxiliary tools.
Copyright 2004, UP Media Group. All rights reserved.
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