Circuits Assembly Online Magazine - Current Issue

News

PHOENIX -- FlipChip International and Kester will collaborate on SE-CURE 7501 low-void wafer bumping paste. Kester, a supplier of solder and related materials and services, has worked with FCI to introduce the solder paste formula designed for wafer bumping. Under the agreement, Kester will manufacture and sell the paste globally.

The paste reportedly features a stable performance down to 70 µm bump heights (corresponding to 135 µm bump pitches) for a consistent printing process. The stable printing provides consistency of bump height across the wafer as well as from wafer to wafer.

STAMFORD, CT- Feinfocus has opened a new office in Shanghai to sell its x-ray systems.

Located in the Zhangjiang Semiconductor Industry Park in Pudong, Feinfocus Asia/Pacific will provide sales and technical support to the growing Asian customer base.

It will operate as part of the newly-expanded COMET China office.

Friedhelm Maur, regional sales manager, and Zoran Zecevic, service engineer, have relocated to Shanghai from the global headquarters in Garbsen, Germany.

SEMI (semi.org) is organizing an export control seminar to take place in conjunction with SEMICON China on March 16 in Shanghai.

Speakers from government and industry will discuss export control requirements related to China and explore what exporters and Chinese customers need to do to meet these requirements and ensure export compliance.

For more information, contact Maggie Hershey: mhershey@semi.org.