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Sanmina-SCI Corp. (San Jose, CA), an electronics manufacturing services (EMS) company, and Teradiant Networks (San Jose, CA), a developer of networking semiconductors, have announced an alliance to accelerate the development of a family of application platforms based on the Advanced Telecom Computing Architecture (ATCA) standard.

 

The platforms' architecture makes it possible for network equipment companies to build systems that scale easily from 20 to 120 Gbps. The platforms are architected around the first ATCA-based traffic management and switching (TMS) card, providing functional integration while reducing power. With industry-standard hardware and a suite of pre-integrated, pre-validate application programming interfaces (APIs), original equipment manufacturers (OEMs) can minimize development time and cost. The API suite also enables OEMs to build proprietary applications that ensure differentiation in their product offerings.

 

With the rollout of scalable platforms in late 2004, Sanmina-SCI and Teradiant will catch the growing wave of interest in ATCA. According to Crystal Cube Consulting, demand for ATCA is expected to produce up to $20 billion per year in networking system sales by the year 2007. ATCA provides a common set of physical and electrical interfaces for telecom and networking equipment, and ATCA-based systems are designed for ease of component reuse and ease of product differentiation.

 

www.teradiant.com

 

www.sanmina-sci.com

 

 

Copyright 2004, UP Media Group. All rights reserved.

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Agilent Technologies Inc. (Palo Alto, CA) has introduced its Versatest series Model V5400 to deliver a low cost of test across a full spectrum of memory devices. According to the company, the model's algorithmic pattern generator (APG) and patented tester-per-site (TPS) architecture provide configuration flexibility and up to four times improvement over existing systems in throughput for wafer sort and final memory testing.

 

Compatible with Agilent's model V4400, the newer version overcomes the challenge of testing standard and stacked memory modules such as flash, DRAM and SRAM while offering up to 4,608 channels and 144 independent test sites. The increased performance and lower system costs helps reduce the overall cost of test for semiconductor contract manufacturers, fabless design houses and memory integrated device manufacturers.

 

The growing consumer demand for digital devices with added functionality and smaller footprints at lower prices has given rise to new test challenges. The devices require higher frequency test systems and the flexibility to test multiple types of memory such as flash and DRAM concurrently, while continuing to require a lower cost of test. Agilent's single, scalable platform architecture will allow users to test standard memories, reduced pin-count devices, BIST-enabled devices and stacked memories.

 

Agilent's TPS architecture makes it possible for each device under test (DUT) to receive its own set of tester resources. The APG on the test site module has the ability to maximize tester resources based on the needs of the DUT. Dynamic APG can independently test up to four low-pin-count DUTs per site module. For complex tests or high pin count devices, APG can reallocate all site module resources toward testing a single DUT. Configurable solely through software, the APG enables the model to test devices without a change in tester hardware.

 

www.agilent.com

 

Copyright 2004, UP Media Group. All rights reserved. Read more ...

LPKF Laser & Electronics (Wilsonville, OR) has announced the new MicroCut II, a high-performance stencil laser with a high-resolution scanner. The laser is capable of cutting any shape, including square apertures with rounded corners, at up to 50,000 apertures per hour. This translates to a cutting speed of 11 openings per second.

 

The high cutting speed is accomplished by a specially-developed system that reduces mechanical movement by moving the laser beam completely independent from the x/y table.

 

The stencil laser has an aperture resolution of 12.5 nm. It can cut apertures as small as 30 µm and its effective material focus diameter of 20 µm produces sharp contours.

 

The stencil laser features proprietary PulseShape technology, which eliminates the heat effect that causes coining or warpage of high-density and thin stencils. As a result, no external coolant is required. The system also incorporates new technology that avoids burrs at exiting edges, so no post-treatment is necessary.

 

System software for laser is optimized for stencil production, processing 500,000 pads in a few minutes.

 

www.lpkfusa.com

 

Copyright 2004, UP Media Group. All rights reserved. Read more ...

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