News
DES PLAINES, IL — Kester will host a lead-free seminar titled, "Project 2005: Achieving Lead-free RoHS Assembly" on May 10 in Orange County, CA and May 12 in Tijuana, Mexico. Guest speakers will present on behalf of KIC and Metcal.
The seminar claims to offer proven, practical information on both lead-free assembly and RoHS compliance. The seminar does not concentrate on specific consumer applications. It offers information and case studies to make reliable lead-free products that are RoHS compliant.
Presentations and discussions will include: lead-free and RoHS directive overview; supply changes and procurement issues; board/component requirements; lead-free alloy selection for SMT, wave and rework; lead-free wave and SMT process optimization; impact of dual systems; BGA rework practices; hand soldering process changes; lead-free RoHS reliability; field rework and training; and training and documentation.
Lunch and refreshments will be provided. Attendees will receive a lead-free assembly technical manual containing presentation materials; technical white papers; and a free subscription to the Lead-Free Connection Newsletter.
For more info, visit www.kester.com.
Minneapolis -- Sponsored by the SMTA, the Pan Pacific Microelectronics symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology,and assembly. The symposium is scheduled for January 17-19, 2006 at the Marriott Waikola Hotel, Hawaii.
The program committee seeking participants to present recent research results on the following topics:
Business:
Cross Cultural Management, Economics and Cost Analysis, Green Manufacturing (Energy Conservation, Pb- and Halogen-free, etc.), Manufacturing Management, Outsourcing Strategies, Roadmaps.
Packaging:
3-D and Stacked Packages, BGA, Chip Scale, Display Drivers, Embedded Devices, Flip Chip, Integrated Passive Devices (IPDs), MCM/SiP, RF and Microwave, Thermal Management, Wafer Level Assembly.
Interconnection:
Advanced PWBs, Co-Fired Ceramics, Flat Panel Displays, Flex / Flex Rigid, HDI, Microvias, Shaped Circuits, Thin and Thick Film Materials.
Characterizations, Penetration Strategies, Segmentation, Technology Drivers, Trends and Forecasts.
Assembly:
Automation Control, Component Placement, Direct Chip Attach, Materials and Processes, Repair and Rework, Test and Troubleshooting.
Actuators, DFX, MEMS/MOEMS, Nanomaterials, Nanosystems, Optoelectronics, Partitioning Strategies, Sensors.
Abstracts should be submitted online by July 15, 2005: smta.org/pan_pac.
OSTEC will provide customers with on-site equipment service, training, applications support and spare parts.
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