News
The CLM9000plus from ESSEMTEC (Glassboro, NJ) is based on a new software and hardware platform. The mechanical improvements include a complete new drive system which results in 20% placement speed increase, as well as improved accuracy and repeatability. Improved bearings result in longer lifetime and less wear. A newly available calibration set that includes glass plates and components allows customers to verify on-site the accuracy of the machine if needed for ISO9000 protocols.
The software is based on the Easyplacer plattform and includes new possibilities to run complete sets of boards or place single boards in multiple boards in any angle in the machine. Automatic height detection of the feeders is now integrated and the software includes an improved link to the management information system software that optimizes the production and keeps track of components and production data.
The integrated vision system from Cognex accurately locates fiducials marks, but also allows to placement beside micro ball grid arrays (BGAs), BGAs, fine pitch components and odd-shape components.
The bad mark sensing option excludes boards automatically from placement or dispensing. Free definable marks can be taught and verified. The new multi field of view option centers and inspects components up to 65 x 65 mm.
Up to 190 feeders with LED indication can be mounted and are now directly linked with ESSEMTEC's MIS system to load/reload components while the machine is placing. The machine can be equipped with a bar code-based set up control to eliminate possible set up errors.
Copyright 2004, UP Media Group. All rights reserved.
"Endicott Interconnect's printed circuit board (PCB), semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," said Jim Herard, marketing manager.
The capital package includes monies for equipment to produce PCBs greater than 28 in. long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included.
Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.
Copyright 2004, UP Media Group. All rights reserved.
Ultrasonic Systems Inc. (Haverhill, MA) has developed a new solution to apply no-clean, low solids flux for lead-free wave soldering. Nozzle-free Ultra-Spray technology with reciprocating motion enables the proper amount of flux to be applied uniformly and repeatably with complete through-hole penetration.
The higher operating temperatures of lead-free alloys require flux chemistries with stable activators, excellent wetting properties and minimal post wave residue. But flux chemistry alone cannot guarantee good soldering success. Precision fluxing technology is the solution. Too little flux can cause bridging and poor wetting. Poor through-hole penetration can result in insufficient solder joints. Too much flux can cause solder balls or leave harmful residues that are not removed in modern no-clean operations.
Visit the company's Web site to learn more about the lead-free spray fluxing solution.
Copyright 2004, UP Media Group. All rights reserved.
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