Products
3D·ViewZ camera module provides shadow-free 3D measurement at high speeds. Combines 2D image acquisition and 3D measurement. Orthogonal, telecentric image recording works with four angled-view cameras and four fringe projectors for measurement of components and solder joints. Inspection technologies use one field of view without additional axis movement. Integrated rotary drive allows up to 360 projection directions for 3D image acquisition.
Goepel electronics, www.goepel.com
Delta Bond optical bonding system dispenses adhesives for display devices in atmosphere, reportedly without bubbles. Is said to be for use with any optically clear adhesive, including acrylics, silicone, and epoxy. Is used for touch screen to LCD and cover glass to LCD. Can include fill dispensing, cover placement, and fluid-flow vision. Employs a gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback. UV cure permits full area cure in place while robotically positioned.
PVA, www.pva.net
535-11M-12 UV cured epoxy has been designed to pass rigorous reliability requirements. Eliminates warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. Can be used for lens bonding, chip encapsulation in smart cards and general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony. Is a screen printable version of 535-11M-7 UV cure adhesive.
Engineered Material Systems, www.emsadhesives.com
Press Releases
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing
- Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor and Advanced Packaging Market
- Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms
- Indium Corporation Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics