Products
640-35 (dam) and 640-46 (fill) dam and fill UV-cured chip encapsulants, for chip-on-board smart card applications, protect wire bonds and reduce stresses associated with thermal cycling. Cure rapidly when exposed to intense UV light centered at 365nm. Are for encapsulating small chips in smart card applications where fast processing is required. Reportedly withstand circuit board reliability test criteria.
Engineered Material Systems, conductives.com
HighDensity module is for inspecting conformal coatings. This orthogonal camera technology for S3088 CCI inspection system is recommended for inspecting nano-plasma coatings. Can inspect temperature-resistant silicone-based coatings used to make smartphones resistant to moisture. Includes high-power LEDs attached around the camera. Can be additionally equipped with four or eight angled cameras. Is reportedly ideal for silicone or thin coatings.
Viscom, www.viscom.com
Nanolaminate coating conducts heat away from an electronics device interior, decreasing its temperature up to 20 degrees. Heat is distributed through the casing of the device, along its surface. Can be applied at low temperatures in volume.
Picosun, picosun.com
Press Releases
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing
- Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor and Advanced Packaging Market
- Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms