Products
QuickLink twist-to-lock compression mount connector replaces surface mount connectors that require a receptacle on the PCB. Mounts directly to the PCB with a twist-to-lock footprint design that requires two small through-holes and a gold pad for the connector to land on. Footprints reportedly can be placed anywhere on the board to permit access to any channels from the device without having to solder on SMA or SMP surface mount receptacles. Low loss to 70GHz; meets bandwidth requirements of PAM4 signaling and Ka/Ku band applications. No threading or tools required.
Ardent Concepts, ardentconcepts.com
PanaCIM Enterprise edition 10 software has new features that bring greater control and functionality to line or floor levels to eliminate single points of failure, permit line-by-line upgrades of equipment and software, and add versatility because they are hot-swappable. Additional advantages include new data storage options, expansive asset maintenance management, process connectivity for factory-wide work-in-process control, digital documents to complement labor skill sets, and a dynamic knowledge base for easier recovery.
Panasonic Factory Solutions Co. of America, www.panasonicfa.com
UniXact fully automated dispenser is a single source system for thermal interface management (TIM), bonding, potting and gasketing applications. Features Cartesian XYZ motion. Is a single source for motion, fluid dispense and process monitoring. Is for dispensable materials used in the production of consumer and automotive electronics. Handles high viscosity, highly abrasive materials, and is capable of handling a wide range of 1K and 2K materials. Programmable at the machine or offline.
Graco, graco.com/unixact
Press Releases
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing
- Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor and Advanced Packaging Market
- Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms