Products
NPM-VF is a dual-gantry, multi-head, odd-form placement and insertion machine. Achieves 4,500cph throughput within narrow footprint of a compact SMT mounter. Standard vacuum nozzle handles a gamut of packages and three additional process heads available for components up to 130x35mm and 60mm tall, requiring 100N force (nearly 22.5 lbf). Has a body chuck for gripping large odd-form devices without a pick surface (e.g., power transformers), lead chuck for gripping through-hole devices (e.g., electrolytic capacitors), and swing nozzle for inserting through-hole devices oriented in packaging other than insertion orientation. Tenders myriad feeder types from bowl feeders to stackable stick, through-hole, vacuum-formed/JEDEC trays, and tape feeders up to 104mm. Active clinch system secures various through-hole lead diameters at multiple rotations. When not required, clinch doubles as localized board support for snap-in/press-fit components.
Panasonic Factory Solutions Company of America, www.panasonicfa.com
Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com
TF 1800 BGA/SMD rework system incorporates top-side inductive-convection heater, which provides rapid heat-up and active cooling of solder joints. Inductive-convection technology allows for an active cooling feature, which provides controlled component/PCB cool down directly through the nozzle. High-efficiency, low thermal mass design reportedly takes less power to operate and is more reliable than conventional heaters. Stepper motor drives automated reflow head. Has 28µm (0.0011”) placement accuracy. Vacuum pick/shaft design with optical sensor is counterweight balanced. Includes adjustable height bottom-side IR preheater. Other features include HD vision overlay system for optical alignment with quad-field imaging capability for placement of outsized BGAs or large fine-pitch QFPs and an integrated underside board support wand to prevent warping during reflow.
Pace Worldwide
Vigon N 680 pH neutral defluxing agent targests low-standoff component cleanliness. Developed for use in spray-in-air inline and batch equipment. Is based on micro phase cleaning technology and is aqueous-based. Removes range of electronic assembly flux residues. Reportedly provides excellent material compatibility, particularly with sensitive metals such as copper.
Zestron, www.zestron.com
Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: PCBWEST.COM
Press Releases
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing
- Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor and Advanced Packaging Market
- Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms