Products
Gap Pad HC 5.0 thermal interface material is designed to manage heat generated by reduced form factor, high-power density components. Is a soft, compliant gap filling material; has a thermal conductivity of 5.0W/m-K and delivers outstanding thermal performance with low compression stress. Is reportedly ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.
Henkel Adhesive Technologies, www.henkel.com/brands-and-businesses/adhesive-technologies
XF-603 flame-retardant material is for automotive under-the-hood and interior labeling applications. Is UL94 VTM-0 rated and third-party tested to FMVSS 302 automotive burn standard. Thermal transfer and flexographic ink-printable. XF-603 is a high-temperature polyimide rated to the UL94 V0 standard, with low smoke and toxicity and an operational temperature of 260°C. Also comes in a low-cost polyester (PET) (XF-611) that operates at 150°C.
Polyonics, www.polyonics.com
AquaRose is an automated water-based batch printed circuit board cleaner and resistivity of solvent extract (ROSE) cleanliness tester. Is 1m x 1m and includes Earth Smart closed-loop DI and chemical wash process. Automatic ROSE ionic cleanliness verification can eliminate the need to pull a sample and run a separate test. Process control features provide limits to be set, monitored and recorded for product/process traceability. Uses high-energy fluid dynamics cleaning design. Product drying times reportedly have been shortened 50% with rotating head dryers.
Austin American Technology, www.aat-corp.com
Press Releases
- KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
- ECIA Executive Conference Announces Session on eCrime Tradecraft
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing