BF-3Di-L1 3D AOI provides measurement of components with a height range from 0-20mm, achieving 1µm height resolution. Is reportedly 50% faster than Saki’s previous 3D machine. Camera and lighting systems capture clear, detailed images with no shadowing for inspection of lifted leads, tombstones, reversed polarity, and height variations. Is available for XXL sizes, in dual-lane configurations, or with optional side-angle cameras.
Saki Shanghai Co., www.sakicorp.com
J8 no-clean solder paste is for use with a variety of jetting paste equipment. Provides consistent solder deposits as small as 200μm. Is fully compatible with all AIM no-clean solder pastes for use in applications where jetted paste deposits are combined with printed paste deposits. Novel activator system provides durable wetting action, accommodating a range of profiles and producing bright, shiny joints without graping. Reduces voiding to as low as <5% on BGA and <10% on BTC ground pads.
AIM Solder, aimsolder.com
P-DMS polymer strain gage is compact and extremely sensitive to slight pressures. A small deformation to the paste generates a change of its electrical resistance, generating an analog signal to enable measurement, input and control to a wide range of applications. Requires no moving parts, can be very accurate and long lasting. Can be directly printed on the application’s control board, and does not need to be connected by wires, eliminating failure points of wire failure and corrosion. Comes in a variety of custom sizes and shapes.
Hoffmann + Krippner, hoffmann-krippner.com