X Line 3D x-ray inspection system enables reliable inspection of THT and pin-in-paste solder joints in compliance with IPC quality standard through a combination of 3D AXI and 2D AOI. Max fault coverage at line cycle times reportedly can be achieved. By scanning image acquisition, time-efficient quality control is possible. Hole fill levels, pin and pad wetting, bridging and solder balls can be detected with one system. Is for safe testing double-sided assembled PCBs. Covers top and bottom sides within a continuous process. Basis is real-time multi-angle image acquisition, allowing a complete 3D capture of the assembly. Integrated reconstruction methods based on planarGT provide detailed evaluation of the PCB under test layer by layer.

Goepel electronic, www.goepel.com