MicReD industrial power tester 1500A combines power cycling and thermal transient measurements with structure function analysis while providing data for real-time failure-cause diagnostics. For power cycling and thermal testing of electronics components to simulate and measure lifetime performance. Tests components without removing them from the test environment. Analyzes thermally-induced mechanical failures such as die-attach wire bond separations, die and package stack-up delamination and cracks, and solder fatigue. Is based on T3Ster advanced thermal tester platform. Performs power cycling tests of metal-oxide semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs) and power diodes. Has user-friendly touch-screen interface. Record range of information during test, such as current, voltage and die temperature sensing; and detailed structure function analysis to record changes in the package’s thermal structure.

Mentor Graphics, www.mentor.com