Products
Indium6.4 solder paste is water-soluble and said to minimize voiding under QFN and BGA assemblies. Reportedly yields less than five% voiding. Comes as standard type 3 powder in Sn63, Sn62, and Indalloy100 (tin, lead and silver).
Indium, www.indium.com
EP21FRNS-2 two-part epoxy has a non-halogen filler. Passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications. Produces low smoke levels. Features one to one mix ratio by weight and cures at room temperature or more quickly at elevated temperatures. Bonds to a variety of substrates including metals, glass, ceramics and many plastics. Withstands exposure to a range of chemicals, such as water, fuels, lubricants and acids, among others. Serviceable over temperature range of -51° to 90°C. Comes in ½ pint, pint, quart, gallon and 5 gal. kits, premixed and frozen syringes, bubble packs and gun dispensers. Is for the computer, aerospace and other industries.
Master Bond, www.masterbond.com
CA-105 conductive LED die attach adhesive is for attaching LEDs and other small semiconductor die to silver and copper lead frames. Has a high glass transition temp. to facilitate wire bonding small die; has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispensing open time (pin transfer) greater than 24 hr. (measured as a 25% increase in viscosity).
Engineered Material Systems, www.emsadhesives.com
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