Products
VT-RNSII inline post-reflow inspection system and VT-RNSII-ptH benchtop model now have faster shutter speeds and improved image processing to perform inspections 20% faster than the original series. Use Color Highlight system that provides 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera system enhances solder shape recognition accuracy. Offer resolution of up to 10µm; support inspection of components as small as 01005 and 12 mil pitch. Optical Character Verification capability is standard. Have EzTS program generation software. Include models for paste inspection and pre-reflow component placement inspection.
Omron, www.omron247.com
ScanVision tool suite for boundary scan design visualization performs multi-board design visualization at the layout and schematic level. Consists of Layout Visualizer, Schematic Visualizer and Virtual Schematic Visualizer. Database is generated by importing individual design data and interconnection referencing. Tools include Cascon Board Merger and Cascon Component Explorer. Performs interactive cross-probing between schematic and layout, selective labeling of pins, components and circuits, and tracking of signal paths via multiple boards with dynamic switching. Enables operations such as test coverage analysis, hardware debugging or graphical fault display far above the board boundaries up to system level. Has System Cascon v. 4.6.1.
Goepel electronic, www.goepelusa.com
MC-400 benchtop pick-and-place machine places 0201s through 100 x 150mm SMDs. 01005 available. Has a placement rate of 3,000 pph. Picks from cut strips, reels, sticks and waffle trays. Has ±0.05mm accuracy and ±0.01mm repeatability. Includes remote diagnostics and full vision alignment. Has a placement area of 415 x 320mm.
Manncorp, www.manncorp.com
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