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Ultima TR2 series selective soldering and fluxing system, for soldering through-hole components and connectors to surface mount and mixed technology PCBs, incorporates a high-precision x-, y-, and z-axis drive that moves the PCB, rather than the solder pot, resulting in a lightweight construction that takes up 36” x 31” of table space. The 35 lb. solder pot and pump assembly features an integral nitrogen hood with a built-in micro-preheater for inerting solder site and stabilizing wave temperature. Feeds live video of soldering process to PC via standard bottom-side witness camera. Universal PCB holder with quick-release cam-locks handles boards up to 13” x 10”, while a larger model is available for 18” x 15” assemblies. Separate fluxer improves throughput (no waiting for soldering to finish before fluxing and vice versa) and keeps over-spray and sticky flux residue away from the soldering operation.

Manncorp, https://www.manncorp.com/selective-soldering/

ProBot is an automatic profiling system that verifies whether each printed circuit board is processed to specification in the reflow oven. Suspect PCBs can be sent to batch x-ray. Allows for more effective sampling. Is designed to fit virtually any reflow oven. Is highly modular; can specify desired features.

KIC, www.kicthermal.com

Sarcon 30QR is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W. Is available in roll or sheet form and can be die-cut, molded or extruded. Use for conductive insulator for semiconductors, compression joining material for thermistors and temperature sensors, as well as gap filler material for all types of heaters. This V-0 flame-retardant thin film is recommended for applications with operational temperatures that range from -60°C to +180°C.

Fujipoly America Corp., www.fujipoly.com

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