Power Price+ calculates production cost and selling price of power components and modules. Evaluates IGBT, MOSFET and power diode technologies and module packaging technology. Provides wafer cost and power chip cost breakdown and evolutions, molded part cost breakdown and evolution, module cost breakdown, yields versus time, module manufacturing cost versus time, and module selling prices versus time. Lists 130 foundries from 79 companies and 22 countries; 60 assembly units among 27 companies and 18 countries; and 100 total manufacturers.
System Plus Consulting, www.systemplus.fr
Urethane nozzle series uses exclusive material to create a vacuum bond with components and is said to improve placement accuracy and reliability while overcoming sticking issues with substrates. Reportedly improves component release onto the board, preventing misplaced parts, lost components, or miss-picks. Can be applied to any style of pick-and-place nozzle for any OEM or machine type.
Count On Tools, www.pbtools.us
TR-1000 vision handler is for tray-to-reel IC device final inspection. Comes with built-in taping module, dual nozzles, and tray-to-tape pick-and-place features, translating to throughput of 12,000 (tray-to-tape). Has comprehensive 3-in-1 vision station for 3-D and 5-sided inspections, and comes with the optional Package Vision Inspection.
ViTrox Technologies, www.vitrox.com