Products
ROI Calculator determines the cost of performing rework and repairs associated with solder contamination in wave solder operations. Determines amount of defects. Input data for shifts, days and working weeks per year.
Solderlab.com, www.solderlab.com/cost_of_rework
SFX5212 I/O module provides independently programmable I/O channels, and reportedly processes voltages up to 30V. Increases test coverage for non-boundary scan circuits or peripheral signals with higher signal voltage by combining structural and functional test procedures on a single platform. In addition to increasing test quality, test costs can be reduced by saving separate process steps.
Goepel Electronic, http://www.goepel.com
DDF Innova Direct Die Feeder converts Assembléon’s pick-and-place machine from a high-speed chipshooter into a high-speed flip-chip bonder, feeding devices directly from up to 300-mm wafers. Conversion permits controlled die bonding speeds up to 15,000 components per hour at maximum accuracy, and passive component placements up to 121,000 cph. Handles system-in-package, multichip module, flip-chips and embedded passive and active components. Supplies bare die directly from up to 300mm (12") wafers in flip chip (bumps down) or direct die (bumps up) mode. Wafer mapping ensures that only known-good-dies with sizes from 0.7mm (any edge), are presented to the machine.
Assembléon, www.assembleon.com
Press Releases
- New Senate Bill Supports Reshoring and Restoring U.S. Printed Circuit Board Manufacturing
- Semi-Kinetics Brings on Colin Forgy to Lead Manufacturing at Idaho Facility
- Absolute EMS Expands Advanced Assembly Capabilities with SASinno Americas PF-6T High-Precision Connector Press-Fit System
- VJ Electronix Partners with The Murray Percival Company to Expand Support Across the Midwest