YSI-X 3D x-ray is for 100% inspection of onboard automotive products and other items. Standard features include x-ray, optical, infrared and laser height measurement. Comes in three types, with minimum resolutions of 3, 7 and 18 microns. Automatically generates inspection unit data using Yamaha placement equipment data. Auto-corrects for PCB warpage using x-y-z fiducial data. Digital laminography (planar CT) makes composite of multiple x-ray images and captures a horizontal cross-sectional slice at optional height.
Yamaha Motor IM, www.yamaha-motor-im.com
ChipVORX FPGA-based I/O modules are controlled via a standard TAP enabling access to the entire ecosystem of test and programming IPs for external instrumentation. FXT-X90 module is based on a Xilinx FPGA, providing 90 I/O channels, whereby 72 are voltage programmable. Is equipped with a transparent TAP; enables daisy-chained cascading of several boards of the same or different types. Various functions for universal frequency measurement, RAM test, fast Flash programming or control of instruments are provided as IP. Provides a separate clock generator. Can be applied as a boundary scan I/O module with dynamic mode switching capability. Is supported by Scanflex boundary scan controllers System Cascon software.
Goepel electronic, www.goepel.com
WaveShuttle Selective provides a standalone setup and verification tool for the selective soldering process. Captures pre-heat temperature profiles from the left and right side of the conveyor, in addition to solder temperature. AutoSeeker II now optimizes any reflow process in seconds. AUTOSeeker software has been updated; is a reflow recipe search tool. Parameter Match Value scores how well each process parameter matches the optimum value, allowing different solutions to be compared graphically using Process Checker Charts.
Solderstar Ltd., www.solderstar.eu