caLogo

Products

Multicore LF620 is a no-clean, halide-free, Pb-free solder paste that has a broad process window for printing, reflow and humidity resistance. Has a consistent print performance with minimal hot slump, even with temperatures of 86°F or more and relative humidity of 80%. Exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes, including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Has good printability at low or high speeds. Is well suited for the automotive sector.  Delivers a high tack force for component stability during high-speed placement, an abandon time of four hours and a print work-life of up to 24 hours.

Henkel, www.henkel.com/electronics
The IS-450 selective soldering machine automatically solders through-hole components onto mixed technology PCBs using an under-board mini-wave; solders connectors, capacitors and high-power devices onto boards at Pb-free process temperatures of 250º to 330ºC. Conducts dip-and-drag selective soldering for post-reflow, through-hole components and odd forms. Is powered by closed-loop servo motors for X, Y & Z axis motion that articulate the fluxer and mini-wave. Maintains adjustable clearance of as little as 1.5 mm. Reportedly solders from 3X to 8X more quickly, and with higher accuracy, than hand soldering. Is programmable off-line to govern wave temperature and height, travel speed and dwell time at each point.

Manncorp, www.manncorp.com

Vectra G Series includes two halogen-free liquid crystal polymer grades with processing characteristics that avoid issues commonly encountered when using flame-retardant, high temperature nylons to mold components. Vectra G131 and G331 are LCPs designed to help meet Pb-free soldering and halogen-free requirements. Vectra G131 is 35% glass-filled; Vectra G331 is 35% mineral- and glass-filled. Both are flame resistant without additives; V-0 to 0.15 mm; potential drop-in solutions for small FR, HT nylon parts. Said to achieve dimensional stability in thin-wall parts at more than 260°C. Processing advantages reportedly include fast molding cycle; no flash and mold deposit; Pb-free reflow capable; no moisture-related blister issues; longer tool life (noncorrosive in water-heated molds).

Ticona Engineering Polymers, www.ticona.com 

Page 1290 of 2036

Don't have an account yet? Register Now!

Sign in to your account