Circuits Assembly Online Magazine - Current Issue

Products

IPC-A-610E, Acceptability of Electronic Assemblies, provides visual acceptance criteria for post-assembly mechanical and soldering assembly requirements. Now addresses additional technologies, including flexible circuits, board-in-board, package-on-package, depanelization and additional SMT terminations. Photos and drawings showing good and bad connections have been updated. Contains 165 new or updated illustrations (800 total). Sections have been reorganized so data and images are easier to find and use. Changes that have occurred in array packaging since the standard’s last revision are also addressed, as are changes to hot tear and filet lifting.

IPC, www.ipc.org

MD-F3000 fiber laser marker is for direct part marking. Delivers 30W of power directly on the target surface; dense, hard metals can be permanently marked and etched in milliseconds. Small head permits easy installation in tight spaces; has a fan-less design and is sealed from dirt and dust. Incorporates 3-axis beam control system that provides marking across a 300 x 300 mm area. Marking Builder-2 software has been upgraded with a new quality function that reduces setup time.

Keyence, www.keyence.com/PRMDF

Uni-Cyclone centrifugal mixer/defoamer is capable of programming duration, cycle profile and up to 1500 RPM centrifugal speed, as well as internal rotational speed. Can be used for solder paste, semiconductor materials, solar pastes, epoxies, and other materials. Mixing of materials and defoaming reportedly accomplished with cycle times half of conventional mixers. Can be controlled from a PC with complete traceability of every program.

Japan Unix, www.japanunix.co.jp/ju_en/index.html