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Sentinel print verification and process management technology captures the full board image, analyzes the data and accepts or rejects the print in real time. Reportedly manages printing inputs and outputs, and integrates verification and traceability tools. Permits printing and high-speed inspection to run concurrently. Offers high-speed paste on pad, bridge detection and alignment capabilities, with vision coverage operating at 36,000 mm2 per sec. Closed-loop control manages alignment, automatic understencil cleaning operations and paste dispensing. Rejects bad boards automatically without interrupting production.  Managed through touch-screen control of Instinctiv V9 software.

DEK International, www.dek.com
SE350 3-D solder paste inspection system has calibration-free sensor technology. Zero machine-to-machine variation across the production lines. Leverages technology of SE500; is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm). 

Cyberoptics Corp., www.cyberoptics.com
FiS640 compact in-circuit tester has a small footprint that can be configured with up to 2048 all-real (non-multiplexed) channels, an analog measurement instrument, and Vectorless test techniques. Is available with a number of fixture interfaces. Test capabilities include standard shorts and opens testing; analog value and analog function testing; vectorless opens testing using ChipScan and CScan; reduced-access boundary scan testing using ScanNavigator software; fast programming of on-board flash and ISP components, and combinational testing using optional off-the-shelf test instruments.

Acculogic Ltd., www.acculogic.com

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