Products
TR7007 3D SPI has a reported throughput of 171cm2/sec. at 14 µm resolution and 87cm2/sec. at 10 µm. Implements a fringe pattern technology and a dual lighting system that eliminates shadows and provides defect detection. Uses a linear motor.
Test Research Inc., www.tri.com.tw
IPC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes, presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling; now provides additional codes for more precise specification of certain Pb-free solders. Provides guidance on marking and labeling of components and PCBs using a range of solder alloys. Enables clear identification of assemblies with lead or Pb-free solder; components that have lead or Pb-free second-level interconnect terminal finishes and materials; base materials used in PCB construction, including halogen-free resin; surface finishes, and conformal coatings. Prescribes maximum component temperature for assembly and rework.
IPC, www.IPC.org
A-Series pick-and-place machine reportedly now places ICs at the same speed and accuracy as chip components using the Twin Placement Robot. TPR eliminates need for extra line balancers; is ideal for DRAM placement. Reportedly places up to 111,000 cph, at accuracy of up to 35 µm. Picks components from front side tape and tray feeder. Has below 10 defects per million.
Assembléon, www.assembleon.com
Press Releases
- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System