Circuits Assembly Online Magazine - Current Issue

Products

Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing. Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Is for fluid packaging operations, including filling vials, bottles and other specialty containers. Can be integrated into robotics and automated production processes. Possesses adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals. Comes in stainless steel and Teflon construction. Model 345 valve controller is ideally suited to actuate this valve.

Tridak, www.tridak.com

Sarcon SPG-30A is a high-viscosity, thermal interface silicone compound designed to transfer heat from a board-level source to a heat sink or heat spreader. Offers a thermal conductivity of 3.2 W/m°K. Also a thermal management option for electronic devices that operate at higher frequencies. Exhibits near-zero compression force and conforms to all component shapes and sizes. Is for filling large gaps around circuit board solder points. Requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range between -40º and 150ºC. Is available in 30cc tubes, 330cc cartridges and 10L pails.

Fujipoly America Corp., www.fujipoly.com

Multicore HF108 is a Pb-free, halogen-free solder paste. Has high-speed print capability, a shelf life of up to six months when refrigerated or four weeks at room temperature, and a wide process window.

Henkel, www.henkel.com/electronics