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Multicore DA101 incorporates a no-clean, ROLO flux and is formulated for printing processes. Is said to withstand temperatures of 300°to 330°C for high-Pb reflow profiles and Pb-free temperatures between 240° and 270°C. Wets to copper, NiPdAu and Ag finishes, among others. Exhibits less that 5% void instances on average. Can be cleaned with standard cleaning chemistries.

Henkel, www.henkel.com/electronics

PCB123 version 3.3 circuit board design software now can convert any layout design files; has full customization via software development kit; bill of materials generated and updated as user designs; offers real-time quotes for board fabrication and parts; can order both boards and parts direct from interface; and includes more fabrication options and services. Free.
 
Sunstone Circuits, www.sunstone.com

 

A thick film dielectric and conductor system improves the mounting of silicon ICs to aluminum substrates. Provides low thermal resistance between the chip and heat sink in applications such as HB LEDs. The glass system of the Pb- and Cd-free dielectric paste was developed to offer thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. Reduces bowing by closely matching the CTE of aluminum. Also, a Pb-free silver conductor paste, fired together at 550°C with the dielectric paste, provides solderability and adhesion. Is for applications such as direct-mounted LEDs.

 

Heraeus Thick Films Materials Business Unit, www.heraeus.com

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