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A new market and technology study on integrated passive devices lists the existing and upcoming technologies and applications for IPDs. Provides an overview of the thin-film IPD market and growth opportunities. Details each market segment with drivers and benefits of IPDs, sub-segment size and expected growth rate, value chain analysis, and global market evaluation per application. Lists links between IPD technologies and their applications.
 
Yole Développement, www.yole.fr

 

Multi-Cure 9001-E Series encapsulants are said to cure in seconds; no mixing required and viscosity is consistent. Have high ionic purity, are solvent-free, and isocyanate-free. Have a low modulus. Contain no sharp, abrasive mineral or glass fillers. Reportedly display excellent adhesion to polyimide, PET, flexible PCBs, FR-4 and ceramic boards, and provide protection for glob top and chip-on-board applications. Are for encapsulating ICs in flex circuits.
 
Dymax Corp., www.dymax.com

The 7722FV pick-and-place machine mounts most fine-pitch components. Placement accuracy for chips, including 0402s, is ±0.1 mm. Bottom vision delivers an accuracy of ±0.05 mm in mounting SOICs, QFPs and BGAs to 40 mm square with a 0.0015" fine-pitch capability. Offers 56-feeder capacity and 6,000 dph.

Manncorp, www.manncorp.com
 

 

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