Products
ITM Marketing, www.itmconsulting.org
S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.
Koki Co. Ltd., www.ko-ki.co.jp
GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.
Seho Systems, www.sehona.com
Press Releases
- Nordson Test & Inspection Announces Strategic Partnership with Quiptech Mexico to Expand Market Presence
- Express Manufacturing, Inc. Expands Inspection Capabilities with Its Second TRI 3D AXI System
- Javad EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
- ubersmt Builds Out SMT Line with Promation PCB Handling Equipment