Circuits Assembly Online Magazine - Current Issue

Products

Alpha CVP-520 solder paste is a Pb-free, no-clean, zero-halogen paste designed for pin-in-through-hole assembly of temperature-sensitive components. Reportedly reflows at peak temperatures of 155° to 190°C. Is said to provide fine feature printing on 0.30 mm circles at speeds up to 100 mm/sec., and in-circuit pin test yield.

Cookson Electronics, www.alpha.cooksonelectronics.com

Hirox's MX-BGAZ II Lens is said to perform easy, accurate BGA exterior observation. Allows ball joints to be observed nondestructively. Has 3-D optical rotary ring, including prism tip with lighting and a cushion mechanism to ensure comfortable observation. Helps specify such problems as overheating, oxidation and air foam formation. Inspects upper and lower ball joints Is capable of up to 180X magnification. Features spring-loaded lens tip to protect samples, and configurable and flexible lineup of lenses and peripheral devices.

Hirox/Seika Machinery, Inc., www.seikausa.com

XE-1000 series robotic soldering systems are for attaching tabbing and bus ribbon to crystalline silicon, amorphous silicon, CIGS and CdTe solar cells. Automate soldering process. Programmable control reportedly permits repeatable soldering over a wide range of format sizes. Can be used for either SnPb or Pb-free applications.

Christopher Associates Inc., www.christopherweb.com