Circuits Assembly Online Magazine - Current Issue

Products

Multi-Cure 9001-E Series encapsulants are said to cure in seconds; no mixing required and viscosity is consistent. Have high ionic purity, are solvent-free, and isocyanate-free. Have a low modulus. Contain no sharp, abrasive mineral or glass fillers. Reportedly display excellent adhesion to polyimide, PET, flexible PCBs, FR-4 and ceramic boards, and provide protection for glob top and chip-on-board applications. Are for encapsulating ICs in flex circuits.

Dymax Corp., www.dymax.com

The 7722FV pick-and-place machine mounts most fine-pitch components. Placement accuracy for chips, including 0402s, is ±0.1 mm. Bottom vision delivers an accuracy of ±0.05 mm in mounting SOICs, QFPs and BGAs to 40 mm square with a 0.0015" fine-pitch capability. Offers 56-feeder capacity and 6,000 dph.

Manncorp, www.manncorp.com

MAP thermal profiling software V2.17c provides features designed to maximize production throughput speed, as well as data retrieval and interpretation. Features include a cropping tool; profile data extraction for cooling slopes after peak; batch download of multiple runs stored on MEGAM.O.L.E. 20 and V-M.O.L.E.; date-time auto file naming option; mouse-over channel descriptions to highlight specific channels, and one-click direct to Excel data exporting in user-specified units.

ECD, www.ecd.com/downloads