Products
Ring Dex filling and capping system is said to be ideal for processing small bottles, tubes and vials in a benchtop package. Features a file-based control system requiring no PC for operation. Setup of fill volumes, capping torques and checking weights is done with pre-programmed graphical interface screens. Production data (for each container) are time and date stamped with recorded fill weight. File may be uploaded for documentation and reporting requirements. Includes an on-board calibration routine.
Dispense Works, www.dispenseworks.com
Dispense Works, www.dispenseworks.com
Quad Lane conveyor system handles four PCBs side-by-side on a single machine. Can produce the same or different products on each track or any combination thereof. When larger boards are needed, switching to traditional transport concepts like the single conveyor, synchronous or asynchronous dual conveyor or i-Placement can be accomplished via software. Available as an option for Siplace X4 and Siplace X4i placement machines.
Siplace, www.siplace.com
Siplace, www.siplace.com
FusionQuad packages are lead-frame-based plastic, offering integration of ExposedPad TQFP and MLF technologies. Are said to extend I/O range of classic lead-frame packaging to nearly 400 unique pins; deliver approximately 50% reduction in package size for a given lead count. The drop test board is intended to evaluate and compare drop performance of dummy electronic components. The thermal test board helps test and optimize assembly methods that may produce significant thermal gradients across the assembly in the x, y and z axes.
Practical Components, www.practicalcompononents.com
