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Products

Araldite EP1000 A/B epoxy adhesive is a two-part, thixotropic paste with a convenient 2:1 mix ratio and low viscosity that accommodates handling. Comes in dual-barrel cartridge mixing kits for waste-free application. Cures at temperatures ranging from ambient to 212ºF. Achieves a stable maximum Tg after gelling at room temperature, followed by a mild heat cure. Requires no autoclave cycling. Reportedly has high lap shear strength and good peel strength.

Huntsman Advanced Materials, www.huntsman.com/advancedmaterials

WS177 lead-free water-soluble solder paste is said to meet standards for solder spread and wetting and meet IPC-7095 Class III resistance to voiding under straight ramp or soak reflow profiles. Is reportedly fully cleanable after two paste reflow cycles, with a wide cleaning process window. Is compatible with SN100C and SN97C alloys with Type 3,4 and 5 solder meshes. Can be used with OSP, ENIG, immersion silver, and immersion tin finishes.

FCT Assembly, www.fctassembly.com

Duralco 122 nickel-filled adhesive and casting epoxy is formulated to provide an alternative to silver-filled, electrically conductive epoxies for applications up to 500ºF. Is said to be ideal for manufacturing and repairing flexible circuits, solder replacement, bonding semiconductors, EMI shielding, thermistors, wire tacking, heating elements, assembling and electronics. Is two-part epoxy mixed by hand. Cures at room temperature in 16-24 hr. at 75ºF, or can be fast-cured in 10 min. at 200ºF. For optimum conductivity, adhesion and strength, post cure at 250º for 2 hr. Is said to be resistant to moisture, chemicals and solvents.

Cotronics Corp., www.cotronics.com