Products
Siplace CA die bonder and SMD placement machine is based on the Siplace X-series platform and processes dies (flip chip and die attach) directly from a wafer, while it can also place conventional SMT components. Reportedly processes up to 36,000 flip-chip components per hour, and can bonds up 36,000 dies per hour at an accuracy of up to 10 µm at 3 sigma. In SMT mode, it reportedly places up to 90,000 cph with an accuracy of 41 µm at 3 sigma. Processes dies from 0.8 to 18.7 mm2 (expanded die bandwidth upon request). Maximum wafer size is 12".
Siemens Electronics Assembly Systems, www.siplace.com
The Wrist Strap and Ground Monitor 773 is said to provide effective workstation monitoring in applications with two metal ground requirements. Grounds and monitors two operators and monitors two metal grounds. Measures ground impedance in automated tools while in operation. Has real-time communication and audio alarm, for immediate shut down should impedance values exceed facility standards. Is miniature, easy to install and unobtrusive on the product floor. ANSI/ESD S6.1 and ANSI/ESD S20.20 compliant.
3M Electronic Solutions Division, www.3mstatic.com
The Easy Flow Blue Pistonis part of the 700 Series premier dispensing line, has close tolerances to fit neatly inside the syringe barrel, ensuring consistent fluid deposition. Prevents air entrapment within dispensed fluid, reportedly providing drip-free dispensing and improved repeatability. Is silicone- and chloride-free, and comes in bulk quantity and packs of 50 pieces.
Techcon Systems, www.techconsystems.com
Press Releases
- VJ Electronix Expands U.S. Coverage with MaRC Technologies Representation in the Pacific Northwest
- Absolute EMS Adopts Luminovo to Modernize and Streamline Quoting
- Iiris Heiskanen Appointed as New CFO of Scanfil
- CE3S Expands Electrostatic Measurement Offering with Next-Generation Compact Static Field Meter from Desco Industries