Hysol UF3800 is said to provide room temperature fast flow, low temperature cure and reworkability. Is for use with CSPs and BGAs; is suited for handheld communication and entertainment applications. Is halogen-free, with less than 900 ppm chlorine and bromine. Is compatible with a variety of Pb-free and halogen-free solder pastes. Offers a high glass transition temperature. Reportedly offers stable electrical performance under temperature humidity bias.
Henkel, www.henkel.com/electronics
Cobar MCI-2330 is a stencil-cleaning agent for removal of solder paste and adhesive residues from all types of stencils. For used in immersion and ultrasonic cleaning equipment for removal of paste or flux residues on stencils and assemblies. Is nonhazardous and has a low odor.
Balver Zinn Group, www.balverzinn.com
Cobar Europe, www.cobar.com