Products
FLX2010C is for placement of special components on film or flex boards. Features a conveyor system said to permit flexible and fast placement on the substrate. Can be placed upstream in the line before a die bonder. In a downstream pick-and-place process, components reportedly are accurately placed on these dice, where the sandwich carrier will be inserted from the left side and stopped by a "stopin" mechanism. The carrier is located with a chuck. Nozzles suck in from the underside of the sandwich carrier at defined positions. The substrate can be populated from conventional component feeder systems after the alignment of the fiducials. The film leaves the placement machine via the conveyor after the release of the sandwich carrier from the vacuum.
Essemtec AG, www.essemtec.com
Essemtec AG, www.essemtec.com
The V3025-B vacuum interrupter assists in precision placement of small parts. The interrupter block controls the vacuum. The hand that holds the vacuum tweezer pen is used to position the part being placed; the other hand taps on the button on the interrupter block to release the part.
Virtual Industries Inc., www.virtual-ii.com
The SP003-ML-V stencil printer is for small and medium volumes. Has an integrated vision system. Offers control over squeegee and speed attributes and reportedly can reproduce them securely. Consists of two quick-fix cameras that look directly through the stencil apertures down to the PCB. Images are simultaneously displayed on two 8" monitors to check alignment. Correction of X, Y and theta axes is possible using backlash-free adjusting screws. Comes standard with a universal PCB fixture mechanism. Adjustable magnetic table can accept single- and double-sided substrates. Print area measures up to 360 x 400 mm; screens and stencils can be mounted in frames with up to 23" x 23" in size.
Essemtec AG, www.essemtec.com
Essemtec AG, www.essemtec.com
