Products
SN100C P520 D5 Pb-free solder paste is said to reduce shrinkage defects, slow intermetallic growth, and offer high-impact strength for 0402 components. Reportedly reflows with minute solder volumes, wets on all common substrates, exhibits minimal cracking of flux residue, and has good hot slump performance.
Nihon Superior Co. Ltd., www.nihonsuperior.co.jp
Nihon Superior Co. Ltd., www.nihonsuperior.co.jp
Extra Fine Solder Wire SN100C (030) reportedly provides sharp spreading and good separation. Is said to reduce bridging in soldering extra fine coaxial harnessing in cellphones. Has a diameter of 0.1 mm. Properties include inhibition of growth of intermetallic layer and low copper erosion.
Nihon Superior Co. Ltd., www.nihonsuperior.co.jp
Nihon Superior Co. Ltd., www.nihonsuperior.co.jp
X5Pro printer is an updated release of the X5 platform. Provides an expanded board size capability and updated I/O system. Is compatible with IPAG integrated paste and glue dispensing system and 2½ D Plus high-speed inspection system. Uses a high-speed servo vision drive system.
EKRA, www.ekra.com
Press Releases
- VJ Electronix Expands U.S. Coverage with MaRC Technologies Representation in the Pacific Northwest
- Absolute EMS Adopts Luminovo to Modernize and Streamline Quoting
- Iiris Heiskanen Appointed as New CFO of Scanfil
- CE3S Expands Electrostatic Measurement Offering with Next-Generation Compact Static Field Meter from Desco Industries