Products
BlissLift now has a wider base for assembly applications. Reportedly doubles the speed of repetitive load/unload tasks. Permits loading of 19" rackmount chassis into a 19" rack on a shipping pallet; legs straddle the pallet. Is said to be ideal for loading chassis onto storage carts and racks. Lifts loads up to 400 lb. Features easy-to-use controls that help prevent dents and scratches.
Bliss Industries, www.blissindustries.com
CION Module/DIMM240 boundary scan I/O digital module is serially controlled via TAP to CION ASIC chips. Enables testing of all signal and voltage supply pins of JEDEC Std. compliant DIMM240 sockets for DDR2-SDRAM. Is plugged into a respective socket, whereby the interface stages’ voltages are adapted automatically. Several boards of the same or different types can be cascaded in a daisy chain configuration. All channels can be independently switched as Input/Output/Tristate. Provides special safety mechanisms. Is supported by all JTAG/boundary scan controllers of ScanBooster and Scanflex families, as well as the Cascon integrated boundary scan software platform system.
Goepel electronic, www.goepel.com
S6053BO-V fully automatic wire bond inspection system is for small wire bond analysis. The camera technology and the transport reportedly can be adapted to varying production demands. Is equipped with a universal, high-resolution VHR camera module. Can inspect down to 2 to 5 µm per pixel. Camera module can be arrayed with one or several cameras and illumination units. Bond wires smaller than 20 µm in diameter can be inspected 100%. Is available in a dual track configuration, including an integrated shuttle that loads the second track as an inspection is conducted on the first track. Is configured for fine bond wire analyses. Also said to inspect components and ASICs with high accuracy.
Viscom, www.viscom.com
Viscom, www.viscom.com
