Products
EP-600 silver-filled electrically conductive two-part epoxy adhesive is for component mounting using dot dispense or screen printing. Is designed to attach components such as resistors, LEDs and grounding wires to metal and plastic substrates where solder or other conductive epoxies requiring high-temperature curing cannot be used. Is said to enable fast build of PTF circuits built on temperature sensitive substrates, such as PET, and for snap curing at low temperatures. Curabe at temperatures of 20º to 140ºC, with cure times ranging from 48 hr. to 2 to 6 min. Snap cure times are possible at higher temperatures. Will cure at room temperature. Once cured, joints on print-treated PET substrates reportedly demonstrate 30 to 40% greater bond strength than other conductive epoxies. Comes in pre-weighed pouches. Is said to reduce dispensing times by up to 70% on high-speed automated dispensers.
Conductive Compounds Inc., www.conductivecompounds.com
Conductive Compounds Inc., www.conductivecompounds.com
The Rhythm EX Selective Soldering System offers a selective soldering range of 24 x 24"; no manual rotation or adjustment is required. Offers closed-loop servo-driven X, Y, and Z-axis motion that articulates the solder wave and flux beneath the PCB. Designed for high-mix or high-volume production. Programmable in minutes to handle basic to complex through-hole soldering. Includes independently heated and programmable Nitrogen inertion and quick-change solder nozzles for keep-away (less than 1.5 mm) and lead protrusion clearance (6 mm). Delivers automation capabilities for wave height management, system standby and startup, automated conveyor width adjustment, dedicated witness vision systems, adjustable temp N2 DirectHeat and EasyLoad solder pot management.
RPS Automation LLC, www.rpsautomation.com
RPS Automation LLC, www.rpsautomation.com
Automatic Vision Control for L-Series pick-and-place systems is said to advance placement of 0201s; 100% accurate on-the-fly, bottom-up vision placement of micro BGAs and ultra fine pitch QFPs. Cognex Machine Vision has 2 µm resolution scales and easy-to-use software. L-Series is for BGA, µBGA, bottom-leaded and odd-shaped component placement down to 0201 components and 0.015" pitch resolution requirements.
APS Novastar, www.apsgold.com/aps.html
APS Novastar, www.apsgold.com/aps.html
