Kester 295 No-Clean Flux is free of halides and bromides. Designed for cored solder wire. Tested to conform to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01, with no chlorine and bromine detected. Designed with blend of rosin and proprietary activator system. Reportedly eliminates splattering and the need for cleaning. Residues are non-conductive and non-corrosive. Is available in a variety of alloys, wire diameters and flux percentages. Is classified as type ROLO flux. Can be used for both lead and Pb-free soldering. Recommended solder iron tip temperature: 260°C to 370°C for Sn63Pb37 and 350°C to 400°C for Pb-free SnAgCu alloys.
A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.
SchmartSolder is said to make hand-soldering through-hole components simple. Is loops of solder produced to fit over component leads. Reportedly melts and flows into the hole quickly.