Products
HM-2520 is a neutral-cure, low-VOC sealant that enables parts to be moved immediately upon application. Has a tensile strength of 700 psi and service temperatures ranging from -50° to 300°F (-45° to 150°C). Is formulated for automated assembly. Is said to combine the immediate green strength of a hot melt adhesive with the long-term performance of a reactive silicone sealant and improved resistance to movement during cure and at high temperatures under load.
Dow Corning, www.dowcorning.com
Dow Corning, www.dowcorning.com
EZReball reballing preforms are available in ball sizes down to 0.20 mm. Can accommodate devices down to 0.4 mm pitch sizes. Solder sphere alloys are available in Pb-free, SnPb and high-temperature alloys. Come in packages of 15 and with a QC stencil.
BEST Inc., www.solder.net
SN100C Pb-free solder spheres are said to offer impact strength and have smooth surfaces free of shrinkage effects. High ductility ensures high impact strength. Additional features include stable intermetallic compound and slow growth of interfacial intermetallic. Suitable for BGA, CSP, MCM and high-density fine-pitch applications.
Nihon Superior, www.nihonsuperior.co.jp
Nihon Superior, www.nihonsuperior.co.jp
Press Releases
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