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The 781RC MicroMark Recirculating Spray System is said to reduce maintenance and downtime associated with conventional marking systems. Uses a recirculating pump to keep pigments in suspension and a short burst of air after each cycle to clear the nozzle of any residue. Applications include components to printed circuit boards.

EFD Inc., www.efd-inc.com

Thermoset MA-511 is a one-component thixotropic epoxy material for use as an adhesive or sealant in microelectronic applications requiring high-speed dispensing. Is said to be a reworkable, low-modulus, non-slumping dispensing adhesive for cap sealing. Cures rapidly, offers adhesion to a variety of plastics; thixotropic rheology permits shape to be maintained after dispensing.
 
Lord Corp., www.lord.com
 
NS-F850 rosin-based flux for lead-free wave soldering ensures wetting and hole fill, and facilitates solder drainage to minimize bridges and icicles. Is said to prevent solder balls from adhering to solder mask. Matte finish facilitates inspection after soldering.

Nihon Superior, www.nihonsuperior.co.jp

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