Products
SP50 for 3-D solder paste inspection features full
volume, height, area and registration measurements. Speeds reportedly up to
38.7cm2/sec. Handles boards up to 19.5 x 19.5”. Features Agilent
head swap technology, which permits alternating equipment from an SP50 to an
SJ50. Has optical encoders and linear motors. speeds may vary depending upon
application. Has scalable 6 μm per pixel resolution and 4 μm height resolution.
Agilent Technologies, www.agilent.com
Agilent Technologies, www.agilent.com
The 781RC MicroMark Recirculating Spray System is said to reduce maintenance and downtime associated with conventional marking systems. Uses a recirculating pump to keep pigments in suspension and a short burst of air after each cycle to clear the nozzle of any residue. Applications include components to printed circuit boards.
EFD Inc., www.efd-inc.com
EFD Inc., www.efd-inc.com
Thermoset MA-511 is a one-component thixotropic epoxy material for use as an adhesive or sealant in microelectronic applications requiring high-speed dispensing. Is said to be a reworkable, low-modulus, non-slumping dispensing adhesive for cap sealing. Cures rapidly, offers adhesion to a variety of plastics; thixotropic rheology permits shape to be maintained after dispensing.
Lord Corp., www.lord.com
Lord Corp., www.lord.com
