Products
The Opto-Bonder Femto handles various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass and simple die attach. Said to combine accuracy (+/-0.5 micron) and flexibility in a small footprint (1270 x 900 mm). Reported features: a 25% larger table, motorized x, y, z and theta movements, maximum die size up to 4" diameter, and substrate size up to 6" diameter. Bonding processes automatically controlled.
Finetech, www.opto-bonder.com
Finetech, www.opto-bonder.com
PowerStrip interconnects are rated for applications up to 28A at 80°C and have up to eight blade style contacts. Forty signal pins are standard and are said to handle up to 3A of current at 80°C. Available for parallel board spacings of 19 mm, and for perpendicular and coplanar board interface applications. These polarized through-hole connectors are for rugged applications; right-angle versions have screw-down features. Are RoHS-complaint and suitable for lead-free processing.
Samtec, www.samtec.com
Samtec, www.samtec.com
The Axiom X-1000 series dispenser is intended for manufacturing in Class 100 cleanrooms. Is designed for applications sensitive to contamination by sub-micron-sized particles. Configured to minimize particle generation within the dispense area. All pneumatic valves are said to be exhausted to the base of the machine. Connection to the house vacuum reportedly avoids downstream particle emissions entering the cleanroom. Is said to be configurable for single or dual-valve dispensing.
