Products
Agilent Process Control Software is a defect-prevention package and has statistical process control and charting package capabilities. Can be used with the Medalist SJ50 AOI and Medalist SP50 solder paste inspection system for paste, pre- and post-reflow trends and defect analysis. Highlights include user-defined charting and alarming, historical and live-data analysis, production summary reports, and worst-feature analysis. Historical and live images are embedded into the charts.
Agilent, www.agilent.com
Araldite 7047 is a one-component, silver-filled epoxy adhesive said to combine high electrical and thermal conductivity. Is said to be a high purity, 100% solids system for void-free bonding of circuitry and ICs. Features a work life of up to four days at room temperature and reportedly cures in one hour at 165ºC (329ºF). Is compatible with Pb-free processing. Has aluminum/aluminum lap shear strength of 1300 psi and gold/gold die shear of 1700 psi at room temp. Volume resistivity at room temp. is <0.0002 ohm-cm. Has a Tg of 130ºC (266ºF) and CTE of 72 ppm/ºC.
Huntsman Advanced Materials, www.huntsman.com/electronics
The Siplace X- and D-Series platform are said to accurately place components down to 01005 with no interruption in speed. The X4 is said to provide the fastest placement output per sq. ft. at 90,000 cph from a single machine. Comes standard with advanced digital component vision. A D2/D1/D1 line has more than 225 feeder inputs and 28 trays. Component range is from 01005 to 8 x 85 mm.
Siemens, www.usa.siemens.com
Siemens, www.usa.siemens.com
