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The Q2 high-speed connector options have been expanded with integrated power pins, RF connectors and retention pins. Come with positive alignment features, edge-mount and right-angle design variations, single-ended and differential signal routing, and optional EMI shielding. In 10 or 11mm mated height and signal pins on 0.635 mm pitch.  Available with up to 156 I/Os per connector set in single-ended configuration and up to 64 pairs in a differential pair configuration. Pricing begins at 0.08¢ per line at 5,000 interconnects.

Samtec, www.samtec.com
 
           

Software upgrades are being offered for CBT6000, model 8000 automatic wire bonders and the model 3500 component placement work cell. Included are the latest operating software, improved vision systems for pattern recognition and Bond Data Miner, which monitors machine and process trends. Reportedly can track and archive traceability data; automatically adapt its process parameters; capture and analyze process and machine trends; and report its own uptime and statistics to any computer in the world.
 
Palomar Technologies, www.palomartechnologies.com
 
SMX Series surface mount DC to 18 GHz packages reportedly have low insertion loss and good return loss and thermal properties. Designed to provide good electrical transition performance for die. Made to provide wideband electrical performance and incorporate copper composite bases for thermal dissipation. Sealed with cup-shaped liquid crystal polymer lids with B-stage epoxy preforms.
 
StratEdge, www.stratedge.com
 
 
 

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