Products
The X1 automated x-ray inspection system automatically analyzes images of solder joints to detect structural defects. A typical inspection program is said to be created in fewer than 30 min. Uses a standard package library. Said to offer high defect detection, fast throughput and low false calls. Remote programming and real-time SPC software provided.
YESTech, www.yestechinc.com
YESTech, www.yestechinc.com
Board Station XE leverages customers’ existing IP, such as libraries, design data, and design capture infrastructure. This extended design flow is added to existing Board Station design environment. Said to offer the productivity design features found in AutoActive placement, routing and manufacturing environment; integrated access to the Topology Planner/Router and XtremeAR and XtremePCB applications. Said to leverage Board Architect schematic capture tool and is integrated with Library Management System (LMS), DMS (Data Management System), I/O Designer and the Constraint Editor System (CES). Also integrated in the flow are ICX Pro, ICX, HyperLynx and Quiet Expert.
Mentor Graphics, www.mentor.com
Mentor Graphics, www.mentor.com
The FS2500N flip chip packaging system is reportedly capable of aligning and bonding at 1.7 sec. per chip at 2 micron accuracy. Underfilling chip with gaps of 14 microns has reportedly been demonstrated in production volume with zero voids. Said to be capable of bonding via thermocompression by pulse heating head, thermosonic by 50 KHz ultrasonic system, Au/Au, Au/Sn and solder. Reported chip sizes of up to 20 x 20 mm with more than 800 bumps and pitches of less than 40 microns.
Toray Engineering Co., Ltd., www.toray.com
Toray Engineering Co., Ltd., www.toray.com
