Products
ECV-100 Coolveyor is a cooling fan conveyor used post-reflow; without proper cooling, damage can occur to Flash programming IC and other temperature-sensitive components. Pb-free soldering, in particular, requires a high-temperature process.
Can efficiently reduce the temperature of a board (PCB and components) with a well-insulated unit that uses a cooling compressor to maintain the interior temperature of 5° to 10°C with a fan. Equipped with an anti-static transparent viewing window.
Benefits include room temperature setting, the capability to accommodate PCBs from 50 x 50 to 250 x 330, air is cooled by the cooling unit, insulated case structure unit with viewing window and conveyor speed control of 1 to 2 m/min. Measures 800 x 1,000 x 1,500 and weighs 310 kg. When setting at 5° to 10°C, the temperature of the board surface drops at 2°C/sec.
Eunil H.A. Americas, eunil.com
Can efficiently reduce the temperature of a board (PCB and components) with a well-insulated unit that uses a cooling compressor to maintain the interior temperature of 5° to 10°C with a fan. Equipped with an anti-static transparent viewing window.
Benefits include room temperature setting, the capability to accommodate PCBs from 50 x 50 to 250 x 330, air is cooled by the cooling unit, insulated case structure unit with viewing window and conveyor speed control of 1 to 2 m/min. Measures 800 x 1,000 x 1,500 and weighs 310 kg. When setting at 5° to 10°C, the temperature of the board surface drops at 2°C/sec.
Eunil H.A. Americas, eunil.com
Adding to its series of recently introduced optimized material sets, Henkel has announced a materials combination designed for stacked CSP (SCSP) devices. Uniting die attach material Hysol QMI536NB with mold compound Hysol GR9820, this material set reportedly delivers JEDEC Level 1/260° reflow performance.
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.
Henkel, www.electronics.henkel.com
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.
Henkel, www.electronics.henkel.com
CTS Connect air-actuated internal or external connectors for effective sealing on smooth, rough or threaded circular features of a part create a tight, long-lasting seal. New leak test accessory products include:
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540
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