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Products

AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.

Enables a tailored coefficient of thermal expansion, offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Eliminates the need for thermal interface stacking.

Said to exhibit a high thermal conductivity for efficient thermal dissipation. Prevents the bowing and flexing of packaging and substrate material that can lead to failure.

The net-shape fabrication process produces the composite material and fabricates the product geometry. Allows rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials.

The unrestricted geometry enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The cast surface supports various identification methods including laser marking, paint, ink and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. Enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes.

CPS Corp., alsic.com

SAC4-XM7S solder-paste provides the desired properties for lead-free applications without the use of nitrogen blanketing or extended profiles to minimize ΔTs.

Said to deliver excellent results in applications requiring extended heating profiles. Remains stable and active during extended heating at elevated temperatures and offers a robust printing window. Available in most common SAC-alloys and in several powder classes.

Cobar, cobar.com

CXInsight for Electronics, a project content management system, allows internal and external collaboration between project members across OEM and manufacturing sites with the latest web security.

Is a product-oriented content management and e-collaboration toolset for use in electronics design, NPI and production environments that require management of structured and unstructured content. Flexible, Web-based server/client system operates independent of OS or application software, and is developed specifically for OEMs and manufacturers working together on projects, regardless of geographic location, language or time zone.

Manages and supports distributed development and NPI across global supply chains via secure (SSL) Internet communication. Handles four key areas:

Development product data management system (PDM Light)
Product oriented, single point of data access for internal/external project members
Graphical product and project file browser
Full project flow control and event logging/tracking system (development and engineering)

Positioned as a PDM-light application, views and controls the complete project flow from project management, task and workload management, through to ECO modification processes, full traceability and event logging.

Adeon Technologies, adeon.nl or cxinsight.com