Products
Goepel electronic has developed a boundary scan option for the Digitaltest In-Circuit Tester series MTS 180, MTS 300 and MTS 888. The solution integrates the recently launched hardware architecture Scanflex in combination with the boundary scan system software Cascon Galaxy, and also involves the ICT digital pin electronics.
“The result of the development cooperation is a completely integrated solution with interaction of the test resources of both systems,” said Bettina Becker, marketing and international sales manager for Goepel. “In particular, the direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each nail acting as additional virtual scan pin in a Boundary Scan test. Applying our philosophy of ‘Extended Boundary Scan’, the user now is able to dramatically increase the test coverage.”
The hardware is based on the Scanflex PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT uses transceiver model SFX-TAP4/C, which provides four programmable TAP for the optimal adaptation to the UUT. The UUT is contacted by means of the standard interface of the ICT. Also, 32 dynamic I/O are available on the hardware.
In terms of software, the complete Cascon Galaxy development and execution environment was integrated into the CITE operating system by Digitaltest via the CAPI interface. All Cascon software editions can run on the ICT.
The ICT pin electronics' control is managed with Hyscan technology implemented in the software. It enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors through a special emulation process. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The manual or automated generation of test vectors, debugging and fault diagnostic are executed by the native JTAG/Boundary Scan tools, whereby each ICT channel acts as a bi-directional Boundary Scan pin at the contacted net, completely transparent to the user.
GÖPEL electronic, goepel.com
“The result of the development cooperation is a completely integrated solution with interaction of the test resources of both systems,” said Bettina Becker, marketing and international sales manager for Goepel. “In particular, the direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each nail acting as additional virtual scan pin in a Boundary Scan test. Applying our philosophy of ‘Extended Boundary Scan’, the user now is able to dramatically increase the test coverage.”
The hardware is based on the Scanflex PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT uses transceiver model SFX-TAP4/C, which provides four programmable TAP for the optimal adaptation to the UUT. The UUT is contacted by means of the standard interface of the ICT. Also, 32 dynamic I/O are available on the hardware.
In terms of software, the complete Cascon Galaxy development and execution environment was integrated into the CITE operating system by Digitaltest via the CAPI interface. All Cascon software editions can run on the ICT.
The ICT pin electronics' control is managed with Hyscan technology implemented in the software. It enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors through a special emulation process. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The manual or automated generation of test vectors, debugging and fault diagnostic are executed by the native JTAG/Boundary Scan tools, whereby each ICT channel acts as a bi-directional Boundary Scan pin at the contacted net, completely transparent to the user.
GÖPEL electronic, goepel.com
Second-generation Condor 500 is now reportedly 30 % faster - with integrated boundary scan and implemented soft landing tool. Flying prober has unique drive technology via linear motor, to ensure high speed and accuracy. The complete software allows fast test program development directly out of the CAD data and the parts-lists. Off-line simulation, panels and different versions of PCBs are also supported. Allows ICT and functional test, opens check, memory test/and programming, boundary scan and vision. Boundary-scan integration allows the heads and further pins to be driven parallel to boundary-scan.Said to improve throughput 3 to 5X over conventional flying prober systems. Software has an integrated quality management system and paperless repair, statistics and fault coverage reports.
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
Customization options are available for 300L and 400L selective soldering machines. Features include combination mini-wave and full-wave soldering, dual pot systems, xy fluxers and endoscope process cameras. Additional options include custom nozzles, rotating landing tables, stamp soldering and batch conveyors. Both are compatible with lead-free alloys. 300L is the economical solution for selective soldering of through-hole components after reflow and includes bare board or mask grippers, internal spray or drop jet fluxers, and installation of various soldering nozzles ranging from 4 to 30 mm in diameter. The high-end 400L offers a three-stage inline system for a high-speed, automated soldering process.
Juki Automation Systems Inc., jas-smt.com
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