Los Angeles, CA -- MS2 Technologies, a P. Kay Metal-affiliated company, has introduced a new technology to enhance wave and selective soldering. The first of the series of products eliminates dross and oxides from the soldering process without the need for nitrogen or other exotic gases. The elimination of dross provides a substantial reduction in electronic assembly material costs especially with the advent of higher priced lead-free solders. The process entered production testing this spring and will be commercially available in November.
The company will launch a version for use with leaded solder and another for lead-free solders, including the various SAC alloys.
Larry Kay, president of P. Kay Metal and MS2 Technologies, and one of the inventors of the process, said, “The use of MS2 will reduce solder purchases for through-hole assembly by 40-75% depending on production volume.”
AIM will highlight its lead-free soldering materials, including the SN100C lead-free alloy, in booth 5434 at AT Expo in Rosemont, IL. In addition, a live lead-free selective soldering demonstration with the alloy is in booth 5437.
SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel.
The small amount of nickel modifies its behavior so that in wave soldering it exhibits fluidity comparable with tin-lead solder. Excess solder drains easily off the joint, so bridges and icicles are avoided. Provides smooth, bright, well-formed fillets which make inspection easy.
Does not contain silver or phosphorus, is less aggressive towards the copper of tracks and pads or the stainless steel components of soldering equipment. Has a low dross rate.
Polyonics introduces 1 and 2 mil color polyimide labels. The labels are
coated with a permanent pressure-sensitive acrylic adhesive and a high
opacity, medium gloss topcoat available in six tinted colors ¾ pink,
yellow, orange, blue, green and violet. They are thermal transfer
printable and scan with both visible and IR scanners. Barcode labels
made from the materials reportedly demonstrate excellent performance in
lead-free wave solder environments, which range from 260º to 290ºC.
Designed
for barcode or alphanumeric identification of PCBs or electronic
components, can withstand mixed circuit board processes, on either the
top or bottom side of the board. Said to have excellent resistance to
harsh fluxes, cleaning agents, saponifiers and wave solder
environments, and resist common methods of cleaning.
Polyonics
developed the labels, which will survive both standard and lead-free
processes on top or bottom side of the board, for manufacturers looking
to color code production/process lines. Some companies
choose to use the plain white polyimide labels for standard
“non-compliant” subassemblies, and a color-coded label (e.g., pink,
yellow, orange, blue, green or violet) for the compliant
products.