Products
IFS-X (Intelligent Feeder System - next generation) uses Cogiscan’s RFID Smart Feeder technology to provide feeder set-up validation.
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Can be retrofitted to existing machines, trolleys and feeders.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
Newport Beach, CA – Router Solutions Inc. (RSI) has released an upgrade module for its data preparation software, CAMCAD. The fixture reuse analysis module allows CAMCAD or Agilent fixture files to be checked against new revisions of boards to determine if the existing fixture can be reused or if it must be rebuilt. Anlysis time is reportedly reduced to minutes, instead of hours or days.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Router Solutions Inc., rsi-inc.com
ALPHA CoolCap was developed to cool components and semiconductor packages during high-temperature lead-free rework and reflow processes.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Press Releases
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- ECIA Executive Conference Announces Session on eCrime Tradecraft
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing