caLogo

Products

Visual 3-D Engineering is a computer-based visualization method allows customers to see engineered solutions in full 3-D, including their product or tool in the cart.

The manufacturing solution allows customers to work with Bliss' engineers to share ideas instead of having to build expensive prototypes. Virtually all interference problems faced in new product development are eliminated.

"It is like looking at a photograph of a product that has not even been built yet," said Ken L. Bliss, president and CEO.

Bliss Industries, blissindustries.com

 

HYDRA Speedmount 21k ER can hande component sizes from 0201 to15 x15 mm large ICs. New mounthead option facilitates multi-picking of a broader range of components.

Uses Linescan vision system for on-the-fly vision centering of the smallest chips up to complex mid-sized components. Mounthead is compatible with a range of tools as well as the automatic tool exchanger. Features the new H05 tool for large components and the H06 tool for ultra small chips.

Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.

Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.

Mydata Automation

 

 

Zestron Asia Pacific will exhibit solutions for PCB/ceramic hybrids, chip packaging and stencil/misprint cleaning applications at Nepcon Shanghai on April 12 - 15.   The Asian technical and sales team can answer your latest questions on lead-free cleaning at booth 2H15. 

www.zestron.com

 

Page 1966 of 2020

Don't have an account yet? Register Now!

Sign in to your account