Circuits Assembly Online Magazine - Current Issue

Products

The Micro thermal imaging system for microscopic applications consists of the Infrasight thermal imaging camera, microscopic 20 μm lens, optical mounting table, vertical focusing stage, locking xy stage with micrometers, adjustable cooling fan, Dell tower PC with LCD multimedia monitor, required cables and Thermalyze image analysis software.

Optional accessories include a thermal stage and controller, I/O module with eight relay outputs and wide-angle lens (resolution 100 μm to ∞).

The camera obtains the temperature at 19,200 individual points on each image with temperature sensitivity of 0.2˚C for the microscopic lens and 0.1˚C with wide angle lens.

The software provide real-time (30 frames/sec) viewing, automatic emissivity correction and analysis tools to obtain the temperature information needed.

Useful in R&D, design, and troubleshooting applications.

OptoTherm Inc., www.optotherm.com

High-speed, continuous screen printing in the lead-free era will be the focus of DEK's presence at SMT 2005 in Nuremberg, Germany, April 19-21. DEK sees the Internet as a key tool in delivering information and services to support these objectives, and will be displaying its latest Internet platforms at its exhibition booth.

The company will also showcase its printing platforms for SMT applications, including the Europa as well as the new Horizon variants that integrate the new Instinctiv user interface.

The company will also demonstrate VectorGuard versions of its stencil technologies, including PumpPrint stencils and new electroformed stencils, as well as stainless steel laser cut stencils. VectorGuard stencils are easy and safe to use on the factory floor, store conveniently in a space-efficient filing system and are easily disassembled at end of life.

Güler Basol, the new Product Manager for European Distributed Products (Consumables) division, will also present the regionalised strategy for its consumables business.

DEK, dek.com

EASYLINE 8088 is a die bonder for sensor assembly. Applications include pressure sensors, accelerometers, gyroscopes and other components related to the automotive, biomedical and IT markets. Offers high-volume die bond technology at an attractive price - performance ratio for the sensor and micro assembly market.

Features high-speed air bearing pick-and-place system, closed-loop linear motor pick tool for unbeaten bond line thickness control and fully automatic wafer handling system. To match MEMS and sensor related demands, an active and precise theta control of the bond head is implemented.

Can handle substrates like lead frames, premolded lead frames and ceramics up to 4.5 x 4.5", great for sensor-related die bonding. Allows exact dispensing of epoxies and solder pastes. The closed-lopped linear motor pick tool provides active control of the placement height, for stable bond line thickness. An "open interface" (SMEMA) allows fast adaptation to third party systems or integration into a production line.

Front access to all major systems simplifies the operation. Footprint is 1m².

Alphasem, alphasem.com