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The Z-2000 series of flame, furnace and tandem atomic absorption spectrophotometers can determine low concentrations of toxic elements such as cadmium, mercury, lead and hexavalent chromium. This is of increasing importance with the implementation of the WEEE Directive and the planned implementation of RoHS next year.

Of particular importance is the determination of these toxic metals in plastic components such as electrical cables. A new method of sample preparation for polyethylene samples has been introduced which uses high-pressure microwave digestion with nitric acid. This replaces traditional extraction methods using sulphuric acid which is not suitable for the measurement of lead. Details of the new extraction method can be found in a new technical data sheet published by Hitachi (AA Sheet No. 72). (For a copy, e-mail info@hitachi-hitec-uk.com).

The Z-2000 Series benefits from the polarized Zeeman background correction method on both flame and furnace instruments, which not only gives extremely effective background elimination but also extremely stable baselines for both methods. The dual beam optics features twin detectors, enhancing detection levels. Detection limits for the flame instrument (in micrograms/g) are Cd: 2, Pb: 50 and Cr: 50. For the furnace instrument they are: Cd: 0.01, Pb: 0.25 and Cr: 0.2, also in micrograms/g.

The series is also suited to the testing of river water for toxic elements. These elements could end up in river water as a result of inappropriate disposal methods of electronic and electrical equipment.

Hitachi High-Technologies Corp,. hitachi-hitec-uk.com

Speedline Technologies has announced several lead-free upgrades for its line of Electrovert Wave Soldering Systems.

40% wider than the traditional tin/lead nozzle, the UltraFill Nozzle increases both contact length and dwell time. The nozzles are placed closer together to reduce the temperature drop between the nozzles – so less superheat is needed to reflow solder joints in the second wave. As a result, hole fill is improved and bridging is reduced. There’s no requirement to slow the conveyor and dross generation is reduced. The nozzles are available in Melonite Corrosion Resistant Stainless Steel or Titanium Material.

An optional Nitrogen shroud is available for use with the Nozzle. Allows for either air or nitrogen operation, as determined by the desired recipe, without the need to change nozzles. The shroud both encompasses the nozzles in the pot and reduces dross formation in nitrogen environments. Lifts for easy maintenance and dedrossing without nozzle removal.

Quick Change Solder Pot provides the capability to easily switch between two alloys, such as between tin/lead and lead-free solders. The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and two trolleys.

Both upgrades are available as an option on new or existing, installed Electrovert EconoPak Gold, Electra and Vectra systems.

Other available upgrades include:

High Velocity Convention (HVC) Topside Preheater, for even topside preheating and tighter Delta T’s across the board;
Reciprocating Spray Fluxing Technology, featuring UltraSpray technology for precise flux deposition, improved through-hole penetration and low maintenance requirements;
Vectaheat Bottomside Preheater, providing efficient, even high thermal mass heating.

Speedline Technologies, speedlinetech.com

Version 10 of Ansoft's HFSS high-frequency/high-speed electromagnetic design product introduces capabilities for design-flow efficiency that allow users to easily share CAD models and results across existing CAD/CAE products. Offers dynamic-link technology to co-simulate with other Ansoft products and extends applications to include RF/analog IC co-design, EMI/EMC and microwave heating.

The ability to reuse third-party CAD models and EDA layouts saves engineering time and allows designers to spend more time optimizing performance. Includes new model healing, meshing technology and model-resolution techniques that simplify the model translation and meshing process.

Expands dynamic-link technology from Ansoft Designer to also include dynamic links to Nexxim(, SIwave, Maxwell and ePhysics for a range of end-user applications, including RF/analog IC, EMI/EMC, chip-package-board co-design and microwave heating. New features include optical incident wave sources, analysis prioritization, queuing and distributed network processing, user-constructed convergence criteria and support for Linux and Windows XP Professional.

Ansoft, ansoft.com or hfss.com